Nanofluids and CPU Cooling: Review of Nanofluids Heat Transfer for CPU Cooling
Keywords:
Nanofluids, CPU cooling, Heat transfer, Electronic devices, Heat sink, Microchannel, Thermal managementAbstract
Nanofluids have emerged as advanced heat transfer media with exceptional thermal properties, and nanofluids are increasingly recognized as key solutions for efficient thermal management in modern electronic systems. Among various cooling technologies, nanofluid-based solutions have proven to be highly effective for CPU cooling due to their superior heat transfer capabilities and tunable thermophysical characteristics. This review focuses on recent developments in nanofluid applications for CPU cooling systems, emphasizing the role of nanoparticle type, concentration, and morphology in enhancing convective heat transfer. Compared with conventional coolants such as water and ethylene glycol, nanofluid coolants demonstrate significantly higher thermal conductivity, enabling faster and more uniform temperature distribution across the CPU surface. Experimental and numerical investigations consistently reveal that nanofluid systems can lower CPU temperatures by up to 20–30 percent, depending on particle volume fraction and flow configuration. The optimal performance of nanofluid coolants typically occurs at particle concentrations below one percent, balancing improved heat transfer and fluid stability. Excessive nanoparticle loading, however, can cause agglomeration, increased viscosity, and clogging in microchannel heat sinks. Studies further indicate that nanofluid performance can be enhanced through hybrid formulations, surface structuring, and magnetohydrodynamic field control, all contributing to improved energy efficiency and reduced thermal resistance in CPU cooling systems. The application of nanofluid technology extends beyond laboratory research to practical implementation in high-performance computing, data centers, and electronic manufacturing. Future designs for CPU cooling should integrate nanofluid selection with optimized microchannel geometries, porous metal heat sinks, and real-time monitoring systems to ensure long-term stability and cost-effectiveness. This comprehensive mini-review underscores that nanofluid-based CPU cooling represents a promising pathway toward next-generation thermal management systems capable of supporting compact, energy-efficient, and reliable electronic devices.
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Copyright (c) 2025 Ahmed Sule, Muhammad Faizullizam, Safaruddin, Yusrizal
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